半导体材料物理与技术
杨建荣How much do you like this book?
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本书将这一分支学科的专业知识划分为半导体材料概述,物理性能,晶体生长热处理,性能测量和工艺基础技术6个组成部分,通过把分散在众多教科书,专著和文献资料中的专业知识系统地纳入这一学科体系框架,使之成为一本全面介绍半导体材料物理知识,工艺基本原理和实用化技术的专业书籍.
Year:
2020
Edition:
1
Publisher:
科学出版社
Language:
chinese
Pages:
294
ISBN 10:
7030627326
ISBN 13:
9787030627322
File:
PDF, 68.51 MB
Your tags:
IPFS:
CID , CID Blake2b
chinese, 2020
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